Allen and heath ilive t112.The iLive Family


Allen and heath ilive t112


FEATURE SUMMARY.Allen amp Heath iLive T Digital Mixing System


Aug 09,  · Allen & Heath iLive-T/48 Reviews. stars based on. 3 customer reviews iLive-T/48 Reviews Sort By Date Sort By Rating Write Your Review. Jason Castellente from Washington DC. August 15, Music Background: Live Sound Engineer, Pro . About Press Copyright Contact us Creators Advertise Developers Terms Privacy Policy & Safety How YouTube works Test new features Press Copyright Contact us Creators. Bring Me The Horizon with Allen & Heath iLive System. FOH rig with iLive & Dante (32 ch FOH / 32 ch Mon on one iDR using Editor!) Patrick Wolf uses iLive @ Round House London. Introducing the iLive Series from Allen & Heath. Engineer Dave McDonald talks about using iLive .


Allen and heath ilive t112.Allen & heath iLive-T Manuals | ManualsLib

iLive OVERVIEW The Surface is simply a controller for the MixRack. It also has an audio rack built into it to conveniently provide local inputs and outputs at the mix position. Each bank of faders has 4 or 6 layers providing between 72 and control strips depending on the Surface size. There are 4 modular modular Surfaces (iLive, iLive, iLive and iLive) and the 3 more affordable fixed format Surfaces shown here (iLive-R72, iLive-T and iLive-T80). Feb 28,  · Allen amp Heath iLive T Digital Mixing System. PAR’s longstanding live-sound contributor hits the road with the T and finds it an intuitive, highly capable digital mixing system that he can enthusiastically recommend. By ProSoundNetwork Editorial Staff. Published: February 28,
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TSMC and UMC will expand production according to 0.13-micron standards

For Taiwanese semiconductor chip manufacturers TSMC and UMC, the issue of quality and scale of production according to 0.13-micron standards is still acute. It depends on which company is able to achieve the best results, who will get the orders for the production of integrated circuits. Both companies report that they have achieved significant improvements in the quality of their products. However, if TSMC is already operating at full production capacity, UMC only expects to reach its design capacity by the end of this year.

UMC, which now produces chips according to 0.13-micron standards on both 200-mm and 300-mm wafers, has 65-70% chip usability at the 200-mm plant and 95% at the 300-mm plant.

However, as the number of orders for 0.13-micron chips grows, both companies plan to expand their production: TSMC is going to invest $ 1.25 billion. into production within a year and has already spent about $ 500 to increase the production capacity of the 300 mm plant from 25,000 wafers to 35,000 wafers monthly. She spent the same amount on her factories and UMC.

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