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FM2A55M-DGS. Supporto per processori Socket FM2 W. Supporta la DDR3 + (OC) a doppio canale. Supporta Intel ® XMP / e AMD Memory Profile. Supporta AMD Dual Graphics. Scheda grafica AMD Radeon HD integrata nella APU A-Series. Opzioni di uscita scheda grafica: . FM2A55M-DGS. Support for Socket FM2 W processors. Supports Dual Channel DDR3 + (OC) Supports Intel ® XMP / and AMD Memory Profile. Supports AMD Dual Graphics. Integrated AMD Radeon HD series graphics in A-series APU. FM2A55M-DGS. 支援 Intel ® XMP / 和 AMD Memory Profile. 支援 ASRock XFast , X-Boost, Fast Boot, Restart to UEFI, OMG, 除濕機, Easy RAID Installer, Interactive UEFI, AMD Steady Video * 為達到 32GB 記憶體容量，16GB (或更高) 的記憶體模組是必需的。. 這些高容量的記憶體模組上市 .
Asrock fm2a55m-dgs.UserBenchmark: Asrock FM2A55M-DGS Compatible Builds
FM2A55M-DGS. Soporte para procesadores con Socket FM2 W. Soporta memoria Dual Channel DDR3 + (OC) Soporta Intel ® XMP / y Perfil de memoria AMD. Soporta AMD Dual Graphics. Gráficos AMD Radeon HD series Integrada en de la APU A-series. Opciones de salida gráficos: D-Sub, DVI-D. Audio canales HD (Códec de audio Realtek. Buy ASRock FM2A55M-DGS FM2 AMD A55 (Hudson D2) Micro ATX AMD Motherboard with fast shipping and top-rated customer service. Newegg shopping upgraded ™4/5(27). FM2A55M-DGS. Supporto per processori Socket FM2 W. Supporta la DDR3 + (OC) a doppio canale. Supporta Intel ® XMP / e AMD Memory Profile. Supporta AMD Dual Graphics. Scheda grafica AMD Radeon HD integrata nella APU A-Series. Opzioni di uscita scheda grafica: .
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ASRock > FM2A55M-DGS
Winbond will involve more TSMC in chip production
Faced with price pressures from development customers
IC, Winbond Electronics plans to attract 0.35 and 0.25-micron chips to the production
technical processes of third-party companies, in the first place ? Taiwan Semiconductor Manufacturing
Company (TSMC). At the same time, noting the increase in DRAM prices, Winbond will provide
8 “Fab-4 and Fab-5 for memory release in the second half of the year. 6 “Fab-2
the company will produce chips according to the 0.40-micron technical process. From the second quarter
Winbond has already engaged TSMC in the production of controllers for cameras.
For the production of specialized DRAM chips, made according to the 0.13-micron process
– for digital cameras and other portable devices Winbond will reserve
25% of 8 “production capacity. Q3 pseudo DRAM shipments
should be about 9000 plates monthly.
According to the company’s specialists, demand should start in the second half of the year
to ordinary DRAM, which is associated with PC upgrades. Based on such forecasts,
Winbond plans to offer DDR400 PCs at prices 15-20% lower than others
companies supplying brandname-memory.