Gigabyte p67a ud3 b3.Gigabyte GA-P67A-UD3-B3 – 1.1 – motherboard – ATX – LGA1155 Socket – P67 Specs

 

Gigabyte p67a ud3 b3

 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

Are you a human?.GA-P67A-UD3-B3 (rev. 1.x) Visão Geral | Placas-mãe – GIGABYTE Brazil

 

Powered by the Intel ® P67 chipset with support for 2nd Generation Intel ® Core™ processors, GIGABYTE P67A-UD3 enjoy uniquely developed technologies such as Smart 6, Cloud OC, Hockey OC technology and Ultra Durable 3 design just to name a few, that ensure a reliable and enjoyable computing experience. Suporte à processadores Intel 22nm. Powered by the Intel ® P67 chipset with support for 2nd Generation Intel ® Core™ processors, GIGABYTE P67A-UD3 enjoy uniquely developed technologies such as Smart 6, Cloud OC, Hotkey OC technology and Ultra Durable 3 Classic design just to name a few, that ensure a reliable and enjoyable computing experience. The GIGABYTE GA-P67A-UD7-B3 enjoys several unique GIGABYTE developed technologies including Maximum Power Delivery technology, Dual CPU Power technology and Ultra Durable 3™ design, just to name a few, that ensure a reliable and long lasting computing experience.

 

Gigabyte p67a ud3 b3.GA-PH67A-UD3-B3 (rev. ) Overview | Motherboard – GIGABYTE Global

Patented GIGABYTE DualBIOS™ technology delivering highest level failure protection Supports the newest LGA 2nd Generation Intel® Core™ processors Supports Intel new B3 stepping 6 series chipset Supports USB with superfast transfer rates of up to 5 Gbps GIGABYTE 3x USB Power with On/Off Charge USB ports Features high speed Gigabit Ethernet Ultra Durable™ 3 technology with 2oz. Powered by the Intel ® P67 chipset with support for 2nd Generation Intel ® Core™ processors, GIGABYTE P67A-UD3 enjoy uniquely developed technologies such as Smart 6, Cloud OC, Hockey OC technology and Ultra Durable 3 design just to name a few, that ensure a reliable and enjoyable computing experience. Suporte à processadores Intel 22nm. Gigabyte GA-P67A-UD3-B3 – – motherboard – ATX – LGA Socket – P67 overview and full product specs on CNET.
 
 
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GA-P67A-UD3 (rev. 1.0)

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GA-P67A-UD3-B3 (rev. 1.x)

GA-P67A-UD3 (rev. ) Overview | Motherboard – GIGABYTE Global
Which to choose IBM: SiLK, CVD or FSG?

Continuing yesterday’s news about the use of low-k insulating films from Taiwan’s TSMC, EE Times Online reports that other industrialists are evaluating the possibility of ditching low-k films in favor of other, more promising ones with their technology point of view. However, even within IBM itself, there is still no consensus on this issue.

On the one hand, the SiLK film used in IBM can be used in technical processes with a lower dielectric constant, and on the other hand, it loses in terms of the coefficient of linear thermal expansion to oxides deposited on carbon in the processes of sublimation chemical substitution (CVD). It should be noted that the problem with a large coefficient of thermal expansion some time ago led to the fact that some of the manufactured chips for Xilinx had to be urgently transferred from SiLK to good old fluorinated silicate glass (FSG).

Now IBM has at least three ways to develop microcircuit production: continue to use SiLK, which, despite its shortcomings, looks quite competitive compared to other technologies, start active CVD development, or continue to use quartz fluoridation, which is slowly starting to look like an anachronism, although also still remains competitive.

According to company representatives, the first products on SiLK are already supplied by Xilinx. The planned 65nm production in the future plans to use a combination of SiLK and CVD. Hybrid stacking technologies will extend to such IBM partners as AMD, Chartered, Toshiba. In addition to IBM, Fujitsu and TSMC use SiLK to create trench coats.

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